MIRWEC Coating has been at the forefront of supporting customers developing cutting-edge 3D IC packaging solutions for the semiconductor industry. Our active participation and innovative approaches are helping to shape the future of advanced semiconductor technologies.
1. Unparalleled coating uniformity with 1-2% tolerance
2. Extremely smooth and stable coating surface
3. Expert web handling
4. Ultra thin film and metal foil coating
5. Mechanical expertise in coating machines
6. UV cure (irradiating with UV lamp)
7. Corona treatment
8. Laminating
80%
Unparalleled coating uniformity with 1-2% tolerance
Extremely smooth and stable coating surface
Expert Web Handling
Ultra thin film and metal foil coating
As little as 2 hours to half a day service
We can coat with or without your presence
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